Searching…
QCC5151 is designed to elevate the truly wireless consumer experience with comprehensive support for our audio technologies, robust connectivity, superior battery life and enhanced ear comfort.
QCC5151采用WLCSP封装，4*4mm-94pin，支持蓝牙5.2，设计支持新一代 蓝牙音频 技术标准LE Audio。 芯片内置四核处理器，双核80MHz 32位应用子系统，双核120MHz 可编程高通Kalimba DSP音频子系统，DSP具有112K程序内存和448K数据内存，工作频率可灵活调节，支持2MHz到120MHz。
QCC5151 Extremely low-power premium tier Bluetooth Audio SoC in a WLCSP package, designed for use in compact, voice-supported, feature rich, truly wireless earbuds.
基本参数模块型号：SJR-BTM551芯片组：QCC5151蓝牙版本：蓝牙5.3双模频段：2.402 - 2.480 GHz协议：A2DP, AVRCP, HFP, HSP, PBAP, SPP, G...
May 9, 2025 · QCC5144、QCC5151以及QCC5171芯片规格书资料项目，为您提供了一手的芯片性能参数和应用指导。 这些规格书涵盖了芯片的核心功能、技术参数和应用场景，是蓝牙音频设备开发者不可或缺的技术宝典。
Qualcomm® QCC5151是一款高端、超低功耗、单芯片解决方案，采用可编程DSP，专为用于真正无线耳塞和可听设备而优化。 QCC5151旨在通过全面支持我们的音频技术、强大的连接性、超长的电池续航时间和增强的耳部舒适度，提升真正的无线消费体验。
Bluetooth Module User Manual details for FCC ID Q2O-QCC5151 made by Lenbrook Industries Limited. Document Includes User Manual QCC5151 Bluetooth Module operating instruction.
Qualcomm Kalimba, Qualcomm cVc, Qualcomm QCC514x, Qualcomm QCC5141, Qualcomm QCC5144, Qualcomm QCC5151, Qualcomm QCC5171 and Qualcomm QCC5181 are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
The QCC5151 is designed for use in consumer electronic products such as headphones, headsets, and TrueWireless stereo earbuds. It complies with FCC Part 15.249/15.247 and RSS-210 Issue 10/RSS-247 Issue 2 regulations, ...
Find out all of the information about the QUALCOMM product: quad-core processor QCC5151. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
